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Dr. Ephraim Suhir
Dr. Ephraim Suhir
Professor, Department of Electrical Engineering
Portland State University
USA
Biography

Dr. Ephraim Suhir is a distinguished Member of Technical Staff, Bell Laboratories, Basic Research, Physical Sciences and Engineering Research Division, USA. He is currently on the board of faculty of the Electrical Engineering Dept. University of California. He is a fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Physical Society, the Institute of Physics, UK, the American Society of Mechanical Engineers (ASME), and the Society of Plastics Engineers. He is a co-founder of the ASME Journal of Electronic Packaging and served as its technical editor for eight years (1993-2001). He has authored about 300 technical publications (patents, papers, book chapters, books). He is an editor of the Springer book series on physics, mechanics and packaging of microelectronic and photonic systems. He organized many successful conferences and symposia and presented numerous keynote and invited talks worldwide and has received many professional awards throughout his carrier. He has been recently elected as Foreign Full Member (Academician) of the National Academy of Engineering and Technological Sciences, Ukraine; as Fulbright Scholar, Council for International Exchange of Scholars (CIES), State Department, US; and as Editor, Silicon Valley Engineering Council (SVEC) Journal. He is Member of the Board of Governors and Distinguished Lecturer of the IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, Associate Editor of the IEEE CPMT Transactions on Advanced Packaging, Member of the ECTC (Electronic Components and Technology Conference) Applied Reliability Subcommittee, the IEEE CPMT award committee, the IEEE Fellow nomination committee, and the ASME General Awards committee.

Research Interest

Applied Mathematics, Applied and Mathematical Physics, Materials Science and Engineering, Applied Mechanics; Applied Probability, Probabilistic Analyses and Probability-Based Physical Designs; Probabilistic Methods in Reliability Engineering, Probabilistic Risk Assessment Management; Analytical (Mathematical) Modeling in Applied Science and Engineering Problems; Photonics, Fiber Optics, Mechanics of Optical Fibers; Design for Reliability of Electronic, Opto-Electonic and Photonic Systems; Composite and 'Smart' Materials Systems; Thin Film Mechanics and Physics; Shock and Vibration Analysis Testing; Dynamic Response of Materials and Structures to Shocks and Vibrations; Thermal Stress Analysis and Prediction and Prevention of Thermal Stress Failures; Solder Joint Interconnections; Polymeric Materials in Electronics and Photonics; Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability; Nanotechnologies and Nanomaterials; Stretchable (Large Area) Electonics and Photonics: Physical Design for Reliability; Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations; Technical Diagnostics, Prognostics and Health Monitoring (PHM); Automotive and Aerospace Electronics and Photonics; Vehicular (Aerospace, Maritime, etc.) Missions Success and Safety; 'Human-in-the-loop': Human-Equipment-Environmental Interaction; Avionics Psychology.

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Terms and Conditions

Responsibility

Delegates are personally responsible for their belongings at the venue. The Organizers will not be held responsible for any stolen or missing items belonging to Delegates, Speakers or Attendees; due to any reason whatsoever.
 
Insurance
 
Registration fees do not include insurance of any kind.
 
Transportation
 
Please note that any (or) all transportation and parking is the responsibility of the registrant.
 
Press/Media
 
Press permission must be obtained from allied academies Conferences Organizing Committee prior to the event. The press will not quote speakers or delegates unless they have obtained their approval in writing. The allied academies is an objective third-party non-profit organization. This conference is not associated with any commercial meeting company.
 
Requesting an Invitation Letter
 
For security purposes, letter of invitation will be sent only to those individuals who had registered for the conference. Once your registration is complete, please contact to request a personalized letter of invitation.

Regarding refunds, all bank charges will be for the registrants account.


Cancellation, Postponement and Transfer of Registration
 
Cancellation Policy
 
If an allied academy cancels this event for any reason, you will receive a credit for 100% of the registration fee paid. You may use this credit for another allied academies event which must occur within one year from the date of cancellation.

Postponement
 
If allied academies  postpone an event for any reason and you are unable or unwilling to attend on rescheduled dates, you will receive a credit for 100% of the registration fee paid. You may use this credit for another allied academies event which must occur within one year from the date of postponement.

Transfer of registration
 
All fully paid registrations are transferable to other persons from the same organization, if registered person is unable to attend the event. Transfers must be made by the registered person in writing to physics@alliedconference.org

Details must be included  with the full name of replacement person, their title, contact phone number and email address. All other registration details will be assigned to the new person unless otherwise specified.
 
Registration can be transferred to one conference to another conference of Allied academies. if the person is unable to attend one of conferences.
 
However, Registration cannot be transferred if it is intimated within 14 days of respective conference.
 
The transferred registrations will not be eligible for Refund.
 
Visa Information
 
Keeping in view of increased security measures, we would like to request all the participants to apply for Visa as soon as possible.

Allied academies will not directly contact embassies and consulates on behalf of visa applicants. All delegates or invitees should apply for Business Visa only.

Important note for failed visa applications: Visa issues cannot come under the consideration of cancellation policy of Allied academies, including the inability to obtain a visa.
 
Refund Policy
 
If the registrant is unable to attend, and is not in a position to transfer his/her participation to another person or event, then the following refund arrangements apply:

Keeping in view of advance payments towards Venue, Printing, Shipping, Hotels and other overheads, we had to keep Refund Policy is as following slabs-
 
Before 60 days of the conference: Eligible for Full Refund less $100 service Fee
Within 60-30 days of Conference: Eligible for 50% of payment Refund
Within 30 days of Conference: Not eligible for Refund
E-Poster Payments will not be refunded.

Accommodation Cancellation Policy
 
Accommodation Providers (Hotels) have their own cancellation policies, and they generally apply when cancellations are made less than 30 days prior to arrival. Please contact us as soon as possible, if you wish to cancel or amend your accommodation. Allied academies will advise the cancellation policy of your accommodation provider, prior to cancelling or amending your booking, to ensure you are fully aware of any non-refundable deposits.

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