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Dr. Ephraim Suhir is a distinguished Member of Technical Staff, Bell Laboratories, Basic Research, Physical Sciences and Engineering Research Division, USA. He is currently on the board of faculty of the Electrical Engineering Dept. University of California. He is a fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Physical Society, the Institute of Physics, UK, the American Society of Mechanical Engineers (ASME), and the Society of Plastics Engineers. He is a co-founder of the ASME Journal of Electronic Packaging and served as its technical editor for eight years (1993-2001). He has authored about 300 technical publications (patents, papers, book chapters, books). He is an editor of the Springer book series on physics, mechanics and packaging of microelectronic and photonic systems. He organized many successful conferences and symposia and presented numerous keynote and invited talks worldwide and has received many professional awards throughout his carrier. He has been recently elected as Foreign Full Member (Academician) of the National Academy of Engineering and Technological Sciences, Ukraine; as Fulbright Scholar, Council for International Exchange of Scholars (CIES), State Department, US; and as Editor, Silicon Valley Engineering Council (SVEC) Journal. He is Member of the Board of Governors and Distinguished Lecturer of the IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, Associate Editor of the IEEE CPMT Transactions on Advanced Packaging, Member of the ECTC (Electronic Components and Technology Conference) Applied Reliability Subcommittee, the IEEE CPMT award committee, the IEEE Fellow nomination committee, and the ASME General Awards committee.
Applied Mathematics, Applied and Mathematical Physics, Materials Science and Engineering, Applied Mechanics; Applied Probability, Probabilistic Analyses and Probability-Based Physical Designs; Probabilistic Methods in Reliability Engineering, Probabilistic Risk Assessment Management; Analytical (Mathematical) Modeling in Applied Science and Engineering Problems; Photonics, Fiber Optics, Mechanics of Optical Fibers; Design for Reliability of Electronic, Opto-Electonic and Photonic Systems; Composite and 'Smart' Materials Systems; Thin Film Mechanics and Physics; Shock and Vibration Analysis Testing; Dynamic Response of Materials and Structures to Shocks and Vibrations; Thermal Stress Analysis and Prediction and Prevention of Thermal Stress Failures; Solder Joint Interconnections; Polymeric Materials in Electronics and Photonics; Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability; Nanotechnologies and Nanomaterials; Stretchable (Large Area) Electonics and Photonics: Physical Design for Reliability; Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations; Technical Diagnostics, Prognostics and Health Monitoring (PHM); Automotive and Aerospace Electronics and Photonics; Vehicular (Aerospace, Maritime, etc.) Missions Success and Safety; 'Human-in-the-loop': Human-Equipment-Environmental Interaction; Avionics Psychology.